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domainsemiicexpo.com
summaryThe provided text appears to be a series of acronyms and technical terms related to semiconductor devices. Here's a summary:

1. SiCGaNLEDSiC MOSFET: This is a Silicon Carbide (SiC) Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) featuring Gallium Nitride (GaN). SiC and GaN are advanced semiconductor materials known for their high electron mobility, temperature stability, and radiation hardness.

2. GaN HEMT: This refers to a High Electron Mobility Transistor (HEMT) made from Gallium Nitride (GaN) material. HEMTs are known for their high-speed performance and efficiency in power electronics applications.

3. IGBT: This stands for Insulated Gate Bipolar Transistor, a type of semiconductor device used as a solid-state switch. It's commonly used in power conversion applications like motor control and lighting systems.

4. PCB (Printed Circuit Board): A fundamental component in electronic devices, providing a physical structure for electrical circuits.

5. MMIC (Monolithic Microwave Integrated Circuit): A type of integrated circuit designed to amplify or otherwise process microwaves, typically used in wireless communication systems.

6. VR (Virtual Reality) and AIoT (Internet of Things): These are advanced technologies that leverage digital information to create immersive experiences (VR) and interconnected devices for data exchange (IoT).

In summary, the text describes various high-performance semiconductor devices, including MOSFETs and HEMTs based on SiC and GaN materials, as well as IGBTs, PCBs, MMICs, VR, and IoT technologies, which are crucial for modern electronic systems, power electronics, and advanced computing applications.
titleAsia Semiconductor and Integrated Circuit Exhibition
descriptionThe Asian Semiconductor and Integrated Circuit Industry Exhibition is the core section of the China Hi-Tech Fair and is held concurrently with the China Hi-Tech Fair. It focuses on displaying all key links in the entire semiconductor industry chain, including IC design, integrated circuits, advanced packaging and testing, equipment manufacturing, electronic components, semiconductor materials, and power devices. It will attract more than 500 leading domestic and foreign companies such as Huawei, Intel, SMIC, and BYD Semiconductor to participate. During the same period, more than 20 professional forums will be held to release more than 100 innovative results, promote domestic substitution and technological independence, and promote technology transactions and investment cooperation.
keywordsoled
upstreams
downstreams
nslookupA 120.77.68.251
created2025-11-08
updated2025-11-08
summarized2025-11-14

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