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domain	pcbchecklist.com
summary	The website content discusses best practices and considerations for designing high-density chip layouts, focusing on several key aspects: 1. Pin marking and component footprints: High-density chips have pin numbers assigned to individual pins, and tick-marks are present for each 510 pin. Square pins on components ensure proper alignment and connection. Footprint dimensions should match the recommended values from the component datasheets. Footprints can be defined as top view or bottom view depending on the component's orientation. 2. Edge connectors: Interleaved (zig-zag) edge-connector fingers improve signal integrity, especially in SODIMM designs, where pins are interleaved when comparing both sides of the inserted board. 3. Signal routing and impedance matching: Digital signals should be routed over separate digital ground planes to minimize noise. High-speed signals must avoid gaps in the ground plane. Stubs (unmatched transmission lines) should be minimized for high-speed signals, and differential pair spacing is based on impedance matching. Transmission lines are terminated with an appropriate impedance to prevent signal reflections. 4. Crystal connections: Short crystal connections are preferred to minimize inductance. A guard ring around the crystal can further reduce EMI/RFI coupling. 5. Placement of drivers and receivers: Drivers and receivers should be placed close to connectors for improved signal integrity, particularly near entry and exit points of shielded areas. 6. Trace avoidance: Traces should be avoided under sensitive components (e.g., RF) and noisy components to minimize noise coupling. Vias should be avoided under metal-film resistors to prevent potential EMI/RFI issues. 7. Shielding can: An option for shielding cans over sensitive circuitry, such as RF circuits, can help reduce EMI/RFI coupling. 8. Bypass capacitors: Low inductance mounting should be used for decoupling near power pins, and bypass capacitors should be placed close to the power pins they are intended to support. 9. Via fencing (for RF lines): Proper via spacing of 120 lambda is essential when working with sensitive RF transmission lines to minimize EMI/RFI coupling.
title	Electronics and electrical design checklist
description	Electronics and electrical design checklist
keywords	there, power, components, pins, have, ground, schematic, board, subsystems, high, layout, testing, pull, connectors, current, design, software
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nslookup	A 185.199.111.153, A 185.199.109.153, A 185.199.108.153, A 185.199.110.153
created	2025-11-08
updated	2025-11-08
summarized	2025-11-13

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